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Evaluation of epoxy underfill materials for solder flip-chip technology

Park, C. E. / Han, B. J. / Bair, H. E. / Raju, V. R.

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Evaluation of epoxy underfill materials for solder flip-chip technology

Park, C. E. / Han, B. J. / Bair, H. E. / Raju, V. R.

Evaluation of epoxy underfill materials for solder flip-chip technology

Park, C. E. / Han, B. J. / Bair, H. E. / Raju, V. R.

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Access via TIB

Check availability in my library

Order at Subito €

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Document information

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Document information

Title:

Evaluation of epoxy underfill materials for solder flip-chip technology

Contributors:

Park, C. E. (author) / Han, B. J. (author) / Bair, H. E. (author) / Raju, V. R. (author)

Published in:

JOURNAL OF MATERIALS SCIENCE LETTERS ; 16 ; 1027-1028

Publication date:

1997-01-01

Size:

2 pages

ISSN:

0261-8028

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

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