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Re-examination on thermal stresses of bonded structures

Wang, W.-C. / Hsu, J.-S.

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Re-examination on thermal stresses of bonded structures

Wang, W.-C. / Hsu, J.-S.

Re-examination on thermal stresses of bonded structures

Wang, W.-C. / Hsu, J.-S.

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Access via TIB

Check availability in my library

Order at Subito €

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Document information

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Document information

Title:

Re-examination on thermal stresses of bonded structures

Contributors:

Wang, W.-C. (author) / Hsu, J.-S. (author)

Published in:

JOURNAL OF STRAIN ANALYSIS FOR ENGINEERING DESIGN ; 39 ; 261-270

Publication date:

2004-01-01

Size:

10 pages

ISSN:

0309-3247

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 624.176

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