Some Fundamental Issues in the Use of Zn-Containing Lead-Free Solders for Electronic Packaging: Fid-Bau Portal

Some Fundamental Issues in the Use of Zn-Containing Lead-Free Solders for Electronic Packaging

Vaynman, S. / Ghosh, G. / Fine, M. E.

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Some Fundamental Issues in the Use of Zn-Containing Lead-Free Solders for Electronic Packaging

Vaynman, S. / Ghosh, G. / Fine, M. E.

Some Fundamental Issues in the Use of Zn-Containing Lead-Free Solders for Electronic Packaging

Vaynman, S. / Ghosh, G. / Fine, M. E.

Access

Access via TIB

Check availability in my library

Order at Subito €

Page navigation

Document information

Similar titles

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Document information

Title:

Some Fundamental Issues in the Use of Zn-Containing Lead-Free Solders for Electronic Packaging

Contributors:

Vaynman, S. (author) / Ghosh, G. (author) / Fine, M. E. (author)

Published in:

MATERIALS TRANSACTIONS ; 45 ; 630-636

Publication date:

2004-01-01

Size:

7 pages

ISSN:

1345-9678

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

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