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Nanoindentation of lead-free solders in microelectronic packaging

Liu, C. Z. / Chen, J.

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Nanoindentation of lead-free solders in microelectronic packaging

Liu, C. Z. / Chen, J.

Nanoindentation of lead-free solders in microelectronic packaging

Liu, C. Z. / Chen, J.

Access

Access via TIB

Check availability in my library

Order at Subito €

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Document information

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Document information

Title:

Nanoindentation of lead-free solders in microelectronic packaging

Contributors:

Liu, C. Z. (author) / Chen, J. (author)

Published in:

MATERIALS SCIENCE AND ENGINEERING A ; 448 ; 340-344

Publication date:

2007-01-01

Size:

5 pages

ISSN:

0921-5093

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

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