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    Effect of Cu Addition to Sn-Ag Lead-Free Solder on Interfacial Stability with Fe-42Ni

    New search for: Hwang, C.-W.
    New search for: Suganuma, K.

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    Effect of Cu Addition to Sn-Ag Lead-Free Solder on Interfacial Stability with Fe-42Ni

    New search for: Hwang, C.-W.
    New search for: Suganuma, K.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Effect of Cu Addition to Sn-Ag Lead-Free Solder on Interfacial Stability with Fe-42Ni

    New search for: Hwang, C.-W.
    New search for: Suganuma, K.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

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    Document information
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    Document information
    Title:

    Effect of Cu Addition to Sn-Ag Lead-Free Solder on Interfacial Stability with Fe-42Ni

    Contributors:

    Hwang, C.-W. (author) / Suganuma, K. (author)

    Published in:

    MATERIALS TRANSACTIONS ; 45 ; 714-720

    Publication date:

    2004-01-01

    Size:

    7 pages

    ISSN:

    1345-9678

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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