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Thermomigration in lead-free solder joints

Abdulhamid, Mohd F. / Li, Shidong / Basaran, Cemal

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Thermomigration in lead-free solder joints

Abdulhamid, Mohd F. / Li, Shidong / Basaran, Cemal

Thermomigration in lead-free solder joints

Abdulhamid, Mohd F. / Li, Shidong / Basaran, Cemal

Access

Access via TIB

Check availability in my library

Order at Subito €

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Document information

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Document information

Title:

Thermomigration in lead-free solder joints

Contributors:

Abdulhamid, Mohd F. (author) / Li, Shidong (author) / Basaran, Cemal (author)

Published in:

International journal of materials and structural integrity ; 2 ; 11-34

Publication date:

2008-01-01

Size:

24 pages

ISSN:

1745-0055

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.112

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