A platform for research: civil engineering, architecture and urbanism
A nonlocal diffuse interface model for microstructure evolution of tin-lead solder
A nonlocal diffuse interface model for microstructure evolution of tin-lead solder
A nonlocal diffuse interface model for microstructure evolution of tin-lead solder
Ubachs, R. L. (author) / Schreurs, P. J. (author) / Geers, M. G. (author)
JOURNAL OF THE MECHANICS AND PHYSICS OF SOLIDS ; 52 ; 1763-1792
2004-01-01
30 pages
Article (Journal)
English
© Metadata Copyright the British Library Board and other contributors. All rights reserved.
A variationally based nonlocal damage model to predict diffuse microcracking evolution
Tema Archive | 2010
|Elasto-viscoplastic nonlocal damage modelling of thermal fatigue in anisotropic lead-free solder
British Library Online Contents | 2007
|Microstructure dependent viscoplastic damage modelling of tin-lead solder
British Library Online Contents | 2006
|British Library Online Contents | 2008
|Nonlocal Interface Mechanical Model
British Library Online Contents | 2007
|