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    Evolution of mechanical and electrical properties of tin–lead and lead free solder to copper joint interface

    New search for: Kar, A.
    New search for: Ghosh, M.
    New search for: Ghosh, R. N.
    New search for: Majumdar, B. S.
    New search for: Ray, A. K.

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    Evolution of mechanical and electrical properties of tin–lead and lead free solder to copper joint interface

    New search for: Kar, A.
    New search for: Ghosh, M.
    New search for: Ghosh, R. N.
    New search for: Majumdar, B. S.
    New search for: Ray, A. K.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Evolution of mechanical and electrical properties of tin–lead and lead free solder to copper joint interface

    New search for: Kar, A.
    New search for: Ghosh, M.
    New search for: Ghosh, R. N.
    New search for: Majumdar, B. S.
    New search for: Ray, A. K.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Evolution of mechanical and electrical properties of tin–lead and lead free solder to copper joint interface

    Contributors:

    Kar, A. (author) / Ghosh, M. (author) / Ghosh, R. N. (author) / Majumdar, B. S. (author) / Ray, A. K. (author)

    Published in:

    MATERIALS LETTERS ; 62 ; 151-154

    Publication date:

    2008-01-01

    Size:

    4 pages

    ISSN:

    0167-577X

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.1105 / 530

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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