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Application of electronic speckle-pattern interferometry to measure in-plane thermal displacement in flip-chip packages
Application of electronic speckle-pattern interferometry to measure in-plane thermal displacement in flip-chip packages
Application of electronic speckle-pattern interferometry to measure in-plane thermal displacement in flip-chip packages
Lee, B. W. (author) / Jang, W. (author) / Kim, D. W. (author) / Jeong, J. h. (author) / Nah, J. W. (author) / Paik, K. W. (author) / Kwon, D. (author)
MATERIALS SCIENCE AND ENGINEERING A. ; 380 ; 231-236
2004-01-01
6 pages
Article (Journal)
English
DDC:
620.11
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