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    A mechanics-induced complication of impression creep and its solution: application to Sn-3.5Ag solder

    New search for: Pan, D.
    New search for: Dutta, I.

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    A mechanics-induced complication of impression creep and its solution: application to Sn-3.5Ag solder

    New search for: Pan, D.
    New search for: Dutta, I.

    Access

    Access via TIB
    Check availability in my library
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    A mechanics-induced complication of impression creep and its solution: application to Sn-3.5Ag solder

    New search for: Pan, D.
    New search for: Dutta, I.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
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    Document information
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    Document information
    Title:

    A mechanics-induced complication of impression creep and its solution: application to Sn-3.5Ag solder

    Contributors:

    Pan, D. (author) / Dutta, I. (author)

    Published in:

    MATERIALS SCIENCE AND ENGINEERING A. ; 379 ; 154-163

    Publication date:

    2004-01-01

    Size:

    10 pages

    ISSN:

    0921-5093

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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