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    Impression creep characterization of rapidly cooled Sn-3.5Ag solders

    New search for: Dutta, I.
    New search for: Park, C.
    New search for: Choi, S.

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    Impression creep characterization of rapidly cooled Sn-3.5Ag solders

    New search for: Dutta, I.
    New search for: Park, C.
    New search for: Choi, S.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Impression creep characterization of rapidly cooled Sn-3.5Ag solders

    New search for: Dutta, I.
    New search for: Park, C.
    New search for: Choi, S.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Impression creep characterization of rapidly cooled Sn-3.5Ag solders

    Contributors:

    Dutta, I. (author) / Park, C. (author) / Choi, S. (author)

    Published in:

    MATERIALS SCIENCE AND ENGINEERING A. ; 379 ; 401-410

    Publication date:

    2004-01-01

    Size:

    10 pages

    ISSN:

    0921-5093

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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