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A platform for research: civil engineering, architecture and urbanism
Stud Bumping and Die Attach for Expanded Flip Chip Applications
Stud Bumping and Die Attach for Expanded Flip Chip Applications
Stud Bumping and Die Attach for Expanded Flip Chip Applications
Mctaggart, V. (author) / Levine, L. (author) / Dunn, G. (author)
ADVANCED PACKAGING ; 13 ; 30-35
2004-01-01
6 pages
Article (Journal)
English
DDC:
658.564
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