A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
Thermal and Mechanical Properties of Flip Chip Package with Au Stud Bump
Thermal and Mechanical Properties of Flip Chip Package with Au Stud Bump
Thermal and Mechanical Properties of Flip Chip Package with Au Stud Bump
Ha, S.-S. (author) / Jung, S.-B. (author)
MATERIALS TRANSACTIONS ; 54 ; 905-910
2013-01-01
6 pages
Article (Journal)
English
DDC:
620.11
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