Damage behavior of Cu-Ta bilayered films under cyclic loading: Fid-Bau Portal

Damage behavior of Cu-Ta bilayered films under cyclic loading

Zhu, X. F. / Zhang, G. P. / Tan, J. / Liu, Y. / Zhu, S. J.

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Damage behavior of Cu-Ta bilayered films under cyclic loading

Zhu, X. F. / Zhang, G. P. / Tan, J. / Liu, Y. / Zhu, S. J.

Damage behavior of Cu-Ta bilayered films under cyclic loading

Zhu, X. F. / Zhang, G. P. / Tan, J. / Liu, Y. / Zhu, S. J.

Access

Access via TIB

Check availability in my library

Order at Subito €

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Document information

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Document information

Title:

Damage behavior of Cu-Ta bilayered films under cyclic loading

Contributors:

Zhu, X. F. (author) / Zhang, G. P. (author) / Tan, J. (author) / Liu, Y. (author) / Zhu, S. J. (author)

Published in:

JOURNAL OF MATERIALS RESEARCH -PITTSBURGH THEN WARRENDALE- ; 22 ; 2478-2482

Publication date:

2007-01-01

Size:

5 pages

ISSN:

0884-2914

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

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