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Spreading Dynamics of Tin, Bismuth and Some Lead-Free Solders over Copper Substrate

Shang, X. / Lauricella, C. M. / Brandi, S. D.

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Spreading Dynamics of Tin, Bismuth and Some Lead-Free Solders over Copper Substrate

Shang, X. / Lauricella, C. M. / Brandi, S. D.

Spreading Dynamics of Tin, Bismuth and Some Lead-Free Solders over Copper Substrate

Shang, X. / Lauricella, C. M. / Brandi, S. D.

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Check availability in my library

Order at Subito €

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Document information

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Document information

Title:

Spreading Dynamics of Tin, Bismuth and Some Lead-Free Solders over Copper Substrate

Contributors:

Shang, X. (author) / Lauricella, C. M. (author) / Brandi, S. D. (author)

Published in:

MATERIALS SCIENCE FORUM ; 475/479 ; 3879-3882

Publication date:

2005-01-01

Size:

4 pages

ISSN:

0255-5476

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

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