A platform for research: civil engineering, architecture and urbanism
The Recrystallization of Microelectronic Lead-Free Solders
The Recrystallization of Microelectronic Lead-Free Solders
The Recrystallization of Microelectronic Lead-Free Solders
Hung, F.-Y. (author) / Lui, T.-S. (author) / Chen, L.-H. (author) / Gu, Z.-F. (author)
MATERIALS TRANSACTIONS ; 49 ; 2298-2302
2008-01-01
5 pages
Article (Journal)
English
DDC:
620.11
© Metadata Copyright the British Library Board and other contributors. All rights reserved.
Nanoindentation of lead-free solders in microelectronic packaging
British Library Online Contents | 2007
|Lead-free Solders in Microelectronics
British Library Online Contents | 2000
|British Library Online Contents | 2000
|Deformation Fracture Characteristics of Microelectronic Sn-3.0Ag-0.5Cu-xNi Solders
British Library Online Contents | 2007
|Novel Ultrasonic Soldering Technique for Lead-Free Solders
British Library Online Contents | 2004
|