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    Technologies for Microdevice Packaging Packaging Requirements for MEMS and MOEMS

    New search for: Pelzer, R.
    New search for: Teomim, D.
    New search for: Perlberg, G.
    New search for: Dragoi, V.

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    Technologies for Microdevice Packaging Packaging Requirements for MEMS and MOEMS

    New search for: Pelzer, R.
    New search for: Teomim, D.
    New search for: Perlberg, G.
    New search for: Dragoi, V.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Technologies for Microdevice Packaging Packaging Requirements for MEMS and MOEMS

    New search for: Pelzer, R.
    New search for: Teomim, D.
    New search for: Perlberg, G.
    New search for: Dragoi, V.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

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    Document information
    Similar titles

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    Document information
    Title:

    Technologies for Microdevice Packaging Packaging Requirements for MEMS and MOEMS

    Contributors:

    Pelzer, R. (author) / Teomim, D. (author) / Perlberg, G. (author) / Dragoi, V. (author)

    Published in:

    ADVANCED PACKAGING ; 13 ; 31-40

    Publication date:

    2004-01-01

    Size:

    10 pages

    ISSN:

    1065-0555

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  658.564

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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