Tight-binding quantum chemical molecular dynamics simulation of mechano-chemical reactions during chemical-mechanical polishing process of SiO2 surface by CeO2 particle: Fid-Bau Portal

Tight-binding quantum chemical molecular dynamics simulation of mechano-chemical reactions during chemical-mechanical polishing process of SiO2 surface by CeO2 particle

Rajendran, A. / Takahashi, Y. / Koyama, M. / Kubo, M. / Miyamoto, A.

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Tight-binding quantum chemical molecular dynamics simulation of mechano-chemical reactions during chemical-mechanical polishing process of SiO2 surface by CeO2 particle

Rajendran, A. / Takahashi, Y. / Koyama, M. / Kubo, M. / Miyamoto, A.

Tight-binding quantum chemical molecular dynamics simulation of mechano-chemical reactions during chemical-mechanical polishing process of SiO2 surface by CeO2 particle

Rajendran, A. / Takahashi, Y. / Koyama, M. / Kubo, M. / Miyamoto, A.

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Document information

Title:

Tight-binding quantum chemical molecular dynamics simulation of mechano-chemical reactions during chemical-mechanical polishing process of SiO2 surface by CeO2 particle

Contributors:

Rajendran, A. (author) / Takahashi, Y. (author) / Koyama, M. (author) / Kubo, M. (author) / Miyamoto, A. (author)

Published in:

APPLIED SURFACE SCIENCE ; 244 ; 34-38

Publication date:

2005-01-01

Size:

5 pages

ISSN:

0169-4332

Type of media:

Article (Journal)