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Characterization of elastic moduli of Cu thin films using nanoindentation technique

Hong, S. H. / Kim, K. S. / Kim, Y. M. / Hahn, J. H. / Lee, C. S. / Park, J. H.

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Characterization of elastic moduli of Cu thin films using nanoindentation technique

Hong, S. H. / Kim, K. S. / Kim, Y. M. / Hahn, J. H. / Lee, C. S. / Park, J. H.

Characterization of elastic moduli of Cu thin films using nanoindentation technique

Hong, S. H. / Kim, K. S. / Kim, Y. M. / Hahn, J. H. / Lee, C. S. / Park, J. H.

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Check availability in my library

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Document information

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Document information

Title:

Characterization of elastic moduli of Cu thin films using nanoindentation technique

Contributors:

Hong, S. H. (author) / Kim, K. S. (author) / Kim, Y. M. (author) / Hahn, J. H. (author) / Lee, C. S. (author) / Park, J. H. (author)

Published in:

COMPOSITES SCIENCE AND TECHNOLOGY ; 65 ; 1401-1408

Publication date:

2005-01-01

Size:

8 pages

ISSN:

0266-3538

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.118

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