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    Measurement of Surface Roughness and Thickness of Silicon Wafers Using an Infrared Laser

    New search for: Koshimizu, S.
    New search for: Tamaki, J.
    New search for: Kuriyagawa, T.
    New search for: Baron, Y. M.

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    Measurement of Surface Roughness and Thickness of Silicon Wafers Using an Infrared Laser

    New search for: Koshimizu, S.
    New search for: Tamaki, J.
    New search for: Kuriyagawa, T.
    New search for: Baron, Y. M.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Measurement of Surface Roughness and Thickness of Silicon Wafers Using an Infrared Laser

    New search for: Koshimizu, S.
    New search for: Tamaki, J.
    New search for: Kuriyagawa, T.
    New search for: Baron, Y. M.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

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    Check availability in my library
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    Document information
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    Document information
    Title:

    Measurement of Surface Roughness and Thickness of Silicon Wafers Using an Infrared Laser

    Contributors:

    Koshimizu, S. (author) / Tamaki, J. / Kuriyagawa, T. / Baron, Y. M.

    Published in:

    Advances in Abrasive Technology VIII ; 377-380

    KEY ENGINEERING MATERIALS ; 291/292

    Publication date:

    2005-01-01

    Size:

    4 pages

    ISSN:

    1013-9826

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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