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Surface damage in wire-cut silicon wafers

Ruixin, F. / Duanlin, Q.

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Surface damage in wire-cut silicon wafers

Ruixin, F. / Duanlin, Q.

Surface damage in wire-cut silicon wafers

Ruixin, F. / Duanlin, Q.

Access

Access via TIB

Check availability in my library

Order at Subito €

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Document information

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Document information

Title:

Surface damage in wire-cut silicon wafers

Contributors:

Ruixin, F. (author) / Duanlin, Q. (author)

Published in:

RARE METALS -BEIJING- ENGLISH EDITION ; 18 ; 315-318

Publication date:

1999-01-01

Size:

4 pages

ISSN:

1001-0521

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 669

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