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Tool wear characteristics and their effects on nanoscale ductile mode cutting of silicon wafer

Li, X. P. / He, T. / Rahman, M.

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Tool wear characteristics and their effects on nanoscale ductile mode cutting of silicon wafer

Li, X. P. / He, T. / Rahman, M.

Tool wear characteristics and their effects on nanoscale ductile mode cutting of silicon wafer

Li, X. P. / He, T. / Rahman, M.

Access

Access via TIB

Check availability in my library

Order at Subito €

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Document information

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Document information

Title:

Tool wear characteristics and their effects on nanoscale ductile mode cutting of silicon wafer

Contributors:

Li, X. P. (author) / He, T. (author) / Rahman, M. (author)

Published in:

WEAR -LAUSANNE- ; 259 ; 1207-1214

Publication date:

2005-01-01

Size:

8 pages

ISSN:

0043-1648

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11292

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