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    Characteristics of "dynamic hard particles" in nanoscale ductile mode cutting of monocrystalline silicon with diamond tools in relation to tool groove wear

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    New search for: Li, X. P.
    New search for: Rahman, M.

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    Characteristics of "dynamic hard particles" in nanoscale ductile mode cutting of monocrystalline silicon with diamond tools in relation to tool groove wear

    New search for: Cai, M. B.
    New search for: Li, X. P.
    New search for: Rahman, M.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Characteristics of "dynamic hard particles" in nanoscale ductile mode cutting of monocrystalline silicon with diamond tools in relation to tool groove wear

    New search for: Cai, M. B.
    New search for: Li, X. P.
    New search for: Rahman, M.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

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    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Characteristics of "dynamic hard particles" in nanoscale ductile mode cutting of monocrystalline silicon with diamond tools in relation to tool groove wear

    Contributors:

    Cai, M. B. (author) / Li, X. P. (author) / Rahman, M. (author)

    Published in:

    WEAR -LAUSANNE- ; 263 ; 1459-1466

    Publication date:

    2007-01-01

    Size:

    8 pages

    ISSN:

    0043-1648

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11292

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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