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    Thermal stability enhancement in nanostructured Cu films containing insoluble tungsten carbides for metallization

    New search for: Chu, J. P.
    New search for: Hsieh, Y. Y.
    New search for: Lin, C. H.
    New search for: Mahalingam, T.

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    Thermal stability enhancement in nanostructured Cu films containing insoluble tungsten carbides for metallization

    New search for: Chu, J. P.
    New search for: Hsieh, Y. Y.
    New search for: Lin, C. H.
    New search for: Mahalingam, T.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Thermal stability enhancement in nanostructured Cu films containing insoluble tungsten carbides for metallization

    New search for: Chu, J. P.
    New search for: Hsieh, Y. Y.
    New search for: Lin, C. H.
    New search for: Mahalingam, T.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Thermal stability enhancement in nanostructured Cu films containing insoluble tungsten carbides for metallization

    Contributors:

    Chu, J. P. (author) / Hsieh, Y. Y. (author) / Lin, C. H. (author) / Mahalingam, T. (author)

    Published in:

    JOURNAL OF MATERIALS RESEARCH -PITTSBURGH THEN WARRENDALE- ; 20 ; 1379-1384

    Publication date:

    2005-01-01

    Size:

    6 pages

    ISSN:

    0884-2914

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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