Fachinformationsdienst BAUdigital

A platform for research: civil engineering, architecture and urbanism

    Sputtered Cu Films Containing Various Insoluble Substances for Advanced Barrierless Metallization

    New search for: Chu, J. P.
    New search for: Lin, C. H.
    New search for: Chandra, T.
    New search for: Tsuzaki, K.
    New search for: Militzer, M.
    New search for: Ravindran, C.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Sputtered Cu Films Containing Various Insoluble Substances for Advanced Barrierless Metallization

    New search for: Chu, J. P.
    New search for: Lin, C. H.
    New search for: Chandra, T.
    New search for: Tsuzaki, K.
    New search for: Militzer, M.
    New search for: Ravindran, C.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Sputtered Cu Films Containing Various Insoluble Substances for Advanced Barrierless Metallization

    New search for: Chu, J. P.
    New search for: Lin, C. H.
    New search for: Chandra, T.
    New search for: Tsuzaki, K.
    New search for: Militzer, M.
    New search for: Ravindran, C.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Sputtered Cu Films Containing Various Insoluble Substances for Advanced Barrierless Metallization

    Contributors:

    Chu, J. P. (author) / Lin, C. H. (author) / Chandra, T. / Tsuzaki, K. / Militzer, M. / Ravindran, C.

    Published in:

    Supplement to THERMEC 2006, 5th International Conference on PROCESSING & MANUFACTURING OF ADVANCED MATERIALS, July 4-8, 2006, Vancouver, Canada ; 3497-3502

    MATERIALS SCIENCE FORUM ; 539/543

    Publication date:

    2007-01-01

    Size:

    6 pages

    ISSN:

    0255-5476

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

    Similar titles

    High-performance copper alloy films for barrierless metallization

    Lin, C. H. / Leau, W. K. / Wu, C. H. | British Library Online Contents | 2010

    Thermal stability enhancement in nanostructured Cu films containing insoluble tungsten carbides for metallization

    Chu, J. P. / Hsieh, Y. Y. / Lin, C. H. et al. | British Library Online Contents | 2005

    Thermal stability of barrierless Cu-Ni-Sn films

    Li, X. N. / Wang, M. / Zhao, L. R. et al. | British Library Online Contents | 2014

    Thermal stability of sputtered copper films containing dilute insoluble tungsten: Thermal annealing study

    Lin, C. H. / Chu, J. P. / Mahalingam, T. et al. | British Library Online Contents | 2003

    Design regulations for barrierless buildings

    Vlcek, M. / Novotny, M. / Mohelnikova, J. et al. | British Library Conference Proceedings | 2007

    Back to top