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Thermal stability of sputtered copper films containing dilute insoluble tungsten: Thermal annealing study

Lin, C. H. / Chu, J. P. / Mahalingam, T. / Lin, T. N. / Wang, S. F.

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Thermal stability of sputtered copper films containing dilute insoluble tungsten: Thermal annealing study

Lin, C. H. / Chu, J. P. / Mahalingam, T. / Lin, T. N. / Wang, S. F.

Thermal stability of sputtered copper films containing dilute insoluble tungsten: Thermal annealing study

Lin, C. H. / Chu, J. P. / Mahalingam, T. / Lin, T. N. / Wang, S. F.

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Check availability in my library

Order at Subito €

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Document information

Title:

Thermal stability of sputtered copper films containing dilute insoluble tungsten: Thermal annealing study

Contributors:

Lin, C. H. (author) / Chu, J. P. (author) / Mahalingam, T. (author) / Lin, T. N. (author) / Wang, S. F. (author)

Published in:

JOURNAL OF MATERIALS RESEARCH -PITTSBURGH THEN WARRENDALE- ; 18 ; 1429-1434

Publication date:

2003-01-01

Size:

6 pages

ISSN:

0884-2914

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

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