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    Optimizing Underfill Materials & Processes: High-volume Assembly of Lead-free Area Array Packages

    New search for: Warwick, M.
    New search for: Dowds, S.

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    Optimizing Underfill Materials & Processes: High-volume Assembly of Lead-free Area Array Packages

    New search for: Warwick, M.
    New search for: Dowds, S.

    Access

    Check availability in my library
    Order at Subito €
    Access via TIB

    Optimizing Underfill Materials & Processes: High-volume Assembly of Lead-free Area Array Packages

    New search for: Warwick, M.
    New search for: Dowds, S.

    Access

    Check availability in my library
    Order at Subito €
    Access via TIB

    Access

    Check availability in my library
    Order at Subito €
    Access via TIB

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    Document information
    Similar titles

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    Document information
    Title:

    Optimizing Underfill Materials & Processes: High-volume Assembly of Lead-free Area Array Packages

    Contributors:

    Warwick, M. ( author ) / Dowds, S. ( author )

    Published in:

    ADVANCED PACKAGING ; 14 ; 28-30

    Publication date:

    2005-01-01

    Size:

    3 pages

    ISSN:

    1065-0555

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  658.564

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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