Effect of Compatibility Between Fluxes and Cyanate Ester Underfill on Lead Free Flip Chip Assembly and Reliability: Fid-Bau Portal

Effect of Compatibility Between Fluxes and Cyanate Ester Underfill on Lead Free Flip Chip Assembly and Reliability

Chaware, R. / Stiborek, L. / Libres, J. / Marquez, M. / Odegard, C. / Cowens, M. / Venkateswaran, M.

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Effect of Compatibility Between Fluxes and Cyanate Ester Underfill on Lead Free Flip Chip Assembly and Reliability

Chaware, R. / Stiborek, L. / Libres, J. / Marquez, M. / Odegard, C. / Cowens, M. / Venkateswaran, M.

Effect of Compatibility Between Fluxes and Cyanate Ester Underfill on Lead Free Flip Chip Assembly and Reliability

Chaware, R. / Stiborek, L. / Libres, J. / Marquez, M. / Odegard, C. / Cowens, M. / Venkateswaran, M.

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Title:

Effect of Compatibility Between Fluxes and Cyanate Ester Underfill on Lead Free Flip Chip Assembly and Reliability

Contributors:

Published in:

ADVANCING MICROELECTRONICS ; 33 ; 10-19

Publication date:

2006-01-01

Size:

10 pages

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 621.381

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