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    The Significance of Underfill on the IC Packages Subjected to Temperature Cyclic Loading

    New search for: Tsai, H.-C.
    New search for: Jong, W.-R.

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    The Significance of Underfill on the IC Packages Subjected to Temperature Cyclic Loading

    New search for: Tsai, H.-C.
    New search for: Jong, W.-R.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    The Significance of Underfill on the IC Packages Subjected to Temperature Cyclic Loading

    New search for: Tsai, H.-C.
    New search for: Jong, W.-R.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

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    Document information
    Similar titles

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    Document information
    Title:

    The Significance of Underfill on the IC Packages Subjected to Temperature Cyclic Loading

    Contributors:

    Tsai, H.-C. (author) / Jong, W.-R. (author)

    Published in:

    JOURNAL OF REINFORCED PLASTICS AND COMPOSITES ; 26 ; 1211-1224

    Publication date:

    2007-01-01

    Size:

    14 pages

    ISSN:

    0731-6844

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.1923

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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