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Micromechanical behavior of single crystalline Ni3Sn4 in micro joints for chip-stacking applications

Yu, L.J. / Yen, H.W. / Wu, J.Y. / Yu, J.J. / Kao, C.R.

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Micromechanical behavior of single crystalline Ni3Sn4 in micro joints for chip-stacking applications

Yu, L.J. / Yen, H.W. / Wu, J.Y. / Yu, J.J. / Kao, C.R.

Micromechanical behavior of single crystalline Ni3Sn4 in micro joints for chip-stacking applications

Yu, L.J. / Yen, H.W. / Wu, J.Y. / Yu, J.J. / Kao, C.R.

Access

Access via TIB

Check availability in my library

Order at Subito €

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Document information

Title:

Micromechanical behavior of single crystalline Ni3Sn4 in micro joints for chip-stacking applications

Contributors:

Yu, L.J. (author) / Yen, H.W. (author) / Wu, J.Y. (author) / Yu, J.J. (author) / Kao, C.R. (author)

Published in:

MATERIALS SCIENCE AND ENGINEERING A ; 685 ; 123-130

Publication date:

2017-01-01

Size:

8 pages

ISSN:

0921-5093

Type of media:

Article (Journal)

Type of material:

Language:

Unknown

Yu, L.J. / Yen, H.W. / Wu, J.Y. et al. | British Library Online Contents | 2017

Micromechanical behavior of single crystalline Ni3Sn4 in micro joints for chip-stacking applications

Yu, L.J. / Yen, H.W. / Wu, J.Y. et al. | British Library Online Contents | 2017

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Yu, J. J. / Wu, J. Y. / Yu, L. J. et al. | British Library Online Contents | 2017

Suppressing Ni3Sn4 formation in the Sn-Ag-Cu solder joints with Ni-P/Pd/Au surface finish

Tseng, C. F. / Lee, T. K. / Ramakrishna, G. et al. | British Library Online Contents | 2011

Elasticity modulus, hardness and fracture toughness of Ni3Sn4 intermetallic thin films

Chen, Z. / He, M. / Balakrisnan, B. et al. | British Library Online Contents | 2006