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Fracture mechanics analysis of the effect of substrate flexibility on solder joint reliability
Fracture mechanics analysis of the effect of substrate flexibility on solder joint reliability
Fracture mechanics analysis of the effect of substrate flexibility on solder joint reliability
Chen, X. (author) / Lin, Y. C. (author) / Liu, X. (author) / Lu, G. Q. (author)
ENGINEERING FRACTURE MECHANICS ; 72 ; 2628-2646
2005-01-01
19 pages
Article (Journal)
English
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