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Fracture mechanics analysis of the effect of substrate flexibility on solder joint reliability

Chen, X. / Lin, Y. C. / Liu, X. / Lu, G. Q.

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Fracture mechanics analysis of the effect of substrate flexibility on solder joint reliability

Chen, X. / Lin, Y. C. / Liu, X. / Lu, G. Q.

Fracture mechanics analysis of the effect of substrate flexibility on solder joint reliability

Chen, X. / Lin, Y. C. / Liu, X. / Lu, G. Q.

Access

Access via TIB

Check availability in my library

Order at Subito €

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Document information

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Document information

Title:

Fracture mechanics analysis of the effect of substrate flexibility on solder joint reliability

Contributors:

Chen, X. (author) / Lin, Y. C. (author) / Liu, X. (author) / Lu, G. Q. (author)

Published in:

ENGINEERING FRACTURE MECHANICS ; 72 ; 2628-2646

Publication date:

2005-01-01

Size:

19 pages

ISSN:

0013-7944

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.1 / 126

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