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    Mixed mode fracture toughness of lead-tin and tin-silver solder joints with nickel-plated substrate

    New search for: Siow, K. S.
    New search for: Manoharan, M.

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    Mixed mode fracture toughness of lead-tin and tin-silver solder joints with nickel-plated substrate

    New search for: Siow, K. S.
    New search for: Manoharan, M.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Mixed mode fracture toughness of lead-tin and tin-silver solder joints with nickel-plated substrate

    New search for: Siow, K. S.
    New search for: Manoharan, M.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

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    Document information
    Similar titles

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    Document information
    Title:

    Mixed mode fracture toughness of lead-tin and tin-silver solder joints with nickel-plated substrate

    Contributors:

    Siow, K. S. (author) / Manoharan, M. (author)

    Published in:

    MATERIALS SCIENCE AND ENGINEERING A ; 404 ; 244-250

    Publication date:

    2005-01-01

    Size:

    7 pages

    ISSN:

    0921-5093

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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