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    Indentation Rate-Dependent Creep Behavior of Sn-Ag-Cu Pb-Free Ball Grid Array (BGA) Solder Joint

    New search for: Wang, F. J.
    New search for: Ma, X.
    New search for: Qian, Y. Y.
    New search for: Naka, M.
    New search for: Yamane, T.

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    Indentation Rate-Dependent Creep Behavior of Sn-Ag-Cu Pb-Free Ball Grid Array (BGA) Solder Joint

    New search for: Wang, F. J.
    New search for: Ma, X.
    New search for: Qian, Y. Y.
    New search for: Naka, M.
    New search for: Yamane, T.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Indentation Rate-Dependent Creep Behavior of Sn-Ag-Cu Pb-Free Ball Grid Array (BGA) Solder Joint

    New search for: Wang, F. J.
    New search for: Ma, X.
    New search for: Qian, Y. Y.
    New search for: Naka, M.
    New search for: Yamane, T.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Indentation Rate-Dependent Creep Behavior of Sn-Ag-Cu Pb-Free Ball Grid Array (BGA) Solder Joint

    Contributors:

    Wang, F. J. (author) / Ma, X. (author) / Qian, Y. Y. (author) / Naka, M. / Yamane, T.

    Published in:

    New Frontiers of Processing and Engineering in Advanced Materials ; 399-404

    MATERIALS SCIENCE FORUM ; 502

    Publication date:

    2005-01-01

    Size:

    6 pages

    ISSN:

    0255-5476

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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