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    Indentation creep of lead-free Sn–3.5Ag solder alloy: Effects of cooling rate and Zn/Sb addition

    New search for: Mahmudi, R.
    New search for: Pourmajidian, M.
    New search for: Geranmayeh, A. R.
    New search for: Gorgannejad, S.
    New search for: Hashemizadeh, S.

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    Indentation creep of lead-free Sn–3.5Ag solder alloy: Effects of cooling rate and Zn/Sb addition

    New search for: Mahmudi, R.
    New search for: Pourmajidian, M.
    New search for: Geranmayeh, A. R.
    New search for: Gorgannejad, S.
    New search for: Hashemizadeh, S.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Indentation creep of lead-free Sn–3.5Ag solder alloy: Effects of cooling rate and Zn/Sb addition

    New search for: Mahmudi, R.
    New search for: Pourmajidian, M.
    New search for: Geranmayeh, A. R.
    New search for: Gorgannejad, S.
    New search for: Hashemizadeh, S.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Indentation creep of lead-free Sn–3.5Ag solder alloy: Effects of cooling rate and Zn/Sb addition

    Contributors:

    Mahmudi, R. (author) / Pourmajidian, M. (author) / Geranmayeh, A. R. (author) / Gorgannejad, S. (author) / Hashemizadeh, S. (author)

    Published in:

    MATERIALS SCIENCE AND ENGINEERING A ; 565 ; 236-242

    Publication date:

    2013-01-01

    Size:

    7 pages

    ISSN:

    0921-5093

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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