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    Relationship between mechanical properties and microstructure of ultra-fine gold bonding wires

    New search for: Kim, K. S.
    New search for: Song, J. Y.
    New search for: Chung, E. K.
    New search for: Park, J. K.
    New search for: Hong, S. H.

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    Relationship between mechanical properties and microstructure of ultra-fine gold bonding wires

    New search for: Kim, K. S.
    New search for: Song, J. Y.
    New search for: Chung, E. K.
    New search for: Park, J. K.
    New search for: Hong, S. H.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Relationship between mechanical properties and microstructure of ultra-fine gold bonding wires

    New search for: Kim, K. S.
    New search for: Song, J. Y.
    New search for: Chung, E. K.
    New search for: Park, J. K.
    New search for: Hong, S. H.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Relationship between mechanical properties and microstructure of ultra-fine gold bonding wires

    Contributors:

    Kim, K. S. (author) / Song, J. Y. (author) / Chung, E. K. (author) / Park, J. K. (author) / Hong, S. H. (author)

    Published in:

    MECHANICS OF MATERIALS ; 38 ; 119-127

    Publication date:

    2006-01-01

    Size:

    9 pages

    ISSN:

    0167-6636

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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