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    The Microstructure Evolution of Copper and Gold Bonding Wires during Annealing

    New search for: Cho, J. H.
    New search for: Rollett, A. D.
    New search for: Oh, K. H.
    New search for: Prangnell, P. B.
    New search for: Bate, P. S.

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    The Microstructure Evolution of Copper and Gold Bonding Wires during Annealing

    New search for: Cho, J. H.
    New search for: Rollett, A. D.
    New search for: Oh, K. H.
    New search for: Prangnell, P. B.
    New search for: Bate, P. S.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    The Microstructure Evolution of Copper and Gold Bonding Wires during Annealing

    New search for: Cho, J. H.
    New search for: Rollett, A. D.
    New search for: Oh, K. H.
    New search for: Prangnell, P. B.
    New search for: Bate, P. S.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    The Microstructure Evolution of Copper and Gold Bonding Wires during Annealing

    Contributors:

    Cho, J. H. (author) / Rollett, A. D. (author) / Oh, K. H. (author) / Prangnell, P. B. / Bate, P. S.

    Published in:

    Fundamentals of Deformation and Annealing: Proceedings of the International Symposium held to coincide with the retirement of Professor John Humphreys in Manchester, UK, 5th - 7th September 2006 ; 399-404

    MATERIALS SCIENCE FORUM ; 550

    Publication date:

    2007-01-01

    Size:

    6 pages

    ISSN:

    0255-5476

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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