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Reactive Diffusion Bonding of SiC~P/Al Composites by Insert Powder Layers with Eutectic Composition
Reactive Diffusion Bonding of SiC~P/Al Composites by Insert Powder Layers with Eutectic Composition
Reactive Diffusion Bonding of SiC~P/Al Composites by Insert Powder Layers with Eutectic Composition
JOURNAL OF MATERIALS SCIENCE AND TECHNOLOGY -SHENYANG- ; 21 ; 779-781
2005-01-01
3 pages
Article (Journal)
English
DDC:
620.11
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