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Reactive diffusion bonding of SiC~p/Al composites by insert layers of mixed powders

Huang, J. H. / Dong, Y. L. / Wan, Y. / Zhang, J. G. / Zhou, G. A.

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Reactive diffusion bonding of SiC~p/Al composites by insert layers of mixed powders

Huang, J. H. / Dong, Y. L. / Wan, Y. / Zhang, J. G. / Zhou, G. A.

Reactive diffusion bonding of SiC~p/Al composites by insert layers of mixed powders

Huang, J. H. / Dong, Y. L. / Wan, Y. / Zhang, J. G. / Zhou, G. A.

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Order at Subito €

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Document information

Title:

Reactive diffusion bonding of SiC~p/Al composites by insert layers of mixed powders

Contributors:

Huang, J. H. (author) / Dong, Y. L. (author) / Wan, Y. (author) / Zhang, J. G. (author) / Zhou, G. A. (author)

Published in:

MATERIALS SCIENCE AND TECHNOLOGY -LONDON- ; 21 ; 1217-1221

Publication date:

2005-01-01

Size:

5 pages

ISSN:

0267-0836

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

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