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Reactive Diffusion Bonding of SiCp/Al MMCs by Insert Layers of Mixed Powder
Reactive Diffusion Bonding of SiCp/Al MMCs by Insert Layers of Mixed Powder
Reactive Diffusion Bonding of SiCp/Al MMCs by Insert Layers of Mixed Powder
Yun, W. (author) / Yueling, D. (author) / Jihua, H. (author)
RARE METAL MATERIALS AND ENGINEERING ; 34 ; 252-256
2005-01-01
5 pages
Article (Journal)
Unknown
DDC:
669
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