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    Joints Soldered on Electroless Ni-Au Surfaces Using Cu-Containing Flux: Strength, Microstructure and Mechanism of Improvement

    New search for: Kumamoto, S.
    New search for: Sakurai, H.
    New search for: Ikeda, K.
    New search for: Suganuma, K.

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    Joints Soldered on Electroless Ni-Au Surfaces Using Cu-Containing Flux: Strength, Microstructure and Mechanism of Improvement

    New search for: Kumamoto, S.
    New search for: Sakurai, H.
    New search for: Ikeda, K.
    New search for: Suganuma, K.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Joints Soldered on Electroless Ni-Au Surfaces Using Cu-Containing Flux: Strength, Microstructure and Mechanism of Improvement

    New search for: Kumamoto, S.
    New search for: Sakurai, H.
    New search for: Ikeda, K.
    New search for: Suganuma, K.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Joints Soldered on Electroless Ni-Au Surfaces Using Cu-Containing Flux: Strength, Microstructure and Mechanism of Improvement

    Contributors:

    Kumamoto, S. (author) / Sakurai, H. (author) / Ikeda, K. (author) / Suganuma, K. (author)

    Published in:

    Special Issue on Lead-Free Soldering in Electronics III ; 2380-2385

    MATERIALS TRANSACTIONS ; 46

    Publication date:

    2005-01-01

    Size:

    6 pages

    ISSN:

    1345-9678

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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