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Joining of Silicon Nitride to Metal (Mo and Ti) Using a Cu-Foil Interlayer
Joining of Silicon Nitride to Metal (Mo and Ti) Using a Cu-Foil Interlayer
Joining of Silicon Nitride to Metal (Mo and Ti) Using a Cu-Foil Interlayer
Flores, J. G. (author) / Cervantes, J. (author) / Lemus, J. (author)
MATERIALS SCIENCE FORUM ; 509 ; 99-104
2006-01-01
6 pages
Article (Journal)
English
DDC:
620.11
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