Joining of Silicon Nitride to Metal (Mo and Ti) Using a Cu-Foil Interlayer: Fid-Bau Portal

Joining of Silicon Nitride to Metal (Mo and Ti) Using a Cu-Foil Interlayer

Flores, J. G. / Cervantes, J. / Lemus, J.

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Joining of Silicon Nitride to Metal (Mo and Ti) Using a Cu-Foil Interlayer

Flores, J. G. / Cervantes, J. / Lemus, J.

Joining of Silicon Nitride to Metal (Mo and Ti) Using a Cu-Foil Interlayer

Flores, J. G. / Cervantes, J. / Lemus, J.

Access

Access via TIB

Check availability in my library

Order at Subito €

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Document information

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Document information

Title:

Joining of Silicon Nitride to Metal (Mo and Ti) Using a Cu-Foil Interlayer

Contributors:

Flores, J. G. (author) / Cervantes, J. (author) / Lemus, J. (author)

Published in:

MATERIALS SCIENCE FORUM ; 509 ; 99-104

Publication date:

2006-01-01

Size:

6 pages

ISSN:

0255-5476

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

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