Joining of Silicon Nitride to Metal (Mo and Ti) Using a Cu-Foil Interlayer: Fid-Bau Portal

Joining of Silicon Nitride to Metal (Mo and Ti) Using a Cu-Foil Interlayer

Flores, J. G. / Cervantes, J. / Lemus, J.

Access

Access via TIB

Check availability in my library

Order at Subito €

Page navigation

Document information

Similar titles

Export, share and cite

Joining of Silicon Nitride to Metal (Mo and Ti) Using a Cu-Foil Interlayer

Flores, J. G. / Cervantes, J. / Lemus, J.

Joining of Silicon Nitride to Metal (Mo and Ti) Using a Cu-Foil Interlayer

Flores, J. G. / Cervantes, J. / Lemus, J.

Access

Access via TIB

Check availability in my library

Order at Subito €

Page navigation

Document information

Similar titles

Export, share and cite

Document information

Title:

Joining of Silicon Nitride to Metal (Mo and Ti) Using a Cu-Foil Interlayer

Contributors:

Flores, J. G. (author) / Cervantes, J. (author) / Lemus, J. (author)

Published in:

MATERIALS SCIENCE FORUM ; 509 ; 99-104

Publication date:

2006-01-01

Size:

6 pages

ISSN:

0255-5476

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

Lemus, J. / Drew, R. A. | British Library Online Contents | 2003

Metal-ceramic interfaces: joining silicon nitride-stainless steel

Polanco, R. / De Pablos, A. / Miranzo, P. et al. | British Library Online Contents | 2004

Effects of FGM Interlayer on Joining Aluminum Nitride Ceramics to Copper

Zhu, S. / Wlosinski, W. / Xu, B. | British Library Online Contents | 2003

Contact reactive brazing of Ti53311S alloy using Cu foil as interlayer: Interfacial microstructure and joining properties

Song, X.G. / Cao, J. / Chen, H.Y. et al. | Elsevier | 2012

Contact reactive brazing of Ti53311S alloy using Cu foil as interlayer: Interfacial microstructure and joining properties

Song, X. G. / Cao, J. / Chen, H. Y. et al. | British Library Online Contents | 2013