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    Formation of Bulk Intermetallic Compound Ag~3Sn in Slowly-Cooled Lead-Free Sn-4.0 wt pct Ag Solders

    New search for: Shen, J.
    New search for: Liu, Y.
    New search for: Han, Y.
    New search for: Zhang, P.
    New search for: Gao, H.

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    Formation of Bulk Intermetallic Compound Ag~3Sn in Slowly-Cooled Lead-Free Sn-4.0 wt pct Ag Solders

    New search for: Shen, J.
    New search for: Liu, Y.
    New search for: Han, Y.
    New search for: Zhang, P.
    New search for: Gao, H.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Formation of Bulk Intermetallic Compound Ag~3Sn in Slowly-Cooled Lead-Free Sn-4.0 wt pct Ag Solders

    New search for: Shen, J.
    New search for: Liu, Y.
    New search for: Han, Y.
    New search for: Zhang, P.
    New search for: Gao, H.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Formation of Bulk Intermetallic Compound Ag~3Sn in Slowly-Cooled Lead-Free Sn-4.0 wt pct Ag Solders

    Contributors:

    Shen, J. (author) / Liu, Y. (author) / Han, Y. (author) / Zhang, P. (author) / Gao, H. (author)

    Published in:

    JOURNAL OF MATERIALS SCIENCE AND TECHNOLOGY -SHENYANG- ; 21 ; 827-830

    Publication date:

    2005-01-01

    Size:

    4 pages

    ISSN:

    1005-0302

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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