Formation of bulk Cu6Sn5 intermetallic compounds in Sn–Cu lead-free solders during solidification: Fid-Bau Portal

Formation of bulk Cu6Sn5 intermetallic compounds in Sn–Cu lead-free solders during solidification

Shen, J. / Liu, Y. C. / Gao, H. X.

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Formation of bulk Cu6Sn5 intermetallic compounds in Sn–Cu lead-free solders during solidification

Shen, J. / Liu, Y. C. / Gao, H. X.

Formation of bulk Cu6Sn5 intermetallic compounds in Sn–Cu lead-free solders during solidification

Shen, J. / Liu, Y. C. / Gao, H. X.

Access

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Check availability in my library

Order at Subito €

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Document information

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Document information

Title:

Formation of bulk Cu6Sn5 intermetallic compounds in Sn–Cu lead-free solders during solidification

Contributors:

Shen, J. (author) / Liu, Y. C. (author) / Gao, H. X. (author)

Published in:

JOURNAL OF MATERIALS SCIENCE ; 42 ; 5375-5380

Publication date:

2007-01-01

Size:

6 pages

ISSN:

0022-2461

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

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