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    Intermetallic compound formation between lead-free solders (Sn) and Cu or Ni electrodes

    New search for: Sasaki, T.
    New search for: Tanaka, M.
    New search for: Ohno, Y.

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    Intermetallic compound formation between lead-free solders (Sn) and Cu or Ni electrodes

    New search for: Sasaki, T.
    New search for: Tanaka, M.
    New search for: Ohno, Y.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Intermetallic compound formation between lead-free solders (Sn) and Cu or Ni electrodes

    New search for: Sasaki, T.
    New search for: Tanaka, M.
    New search for: Ohno, Y.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

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    Document information
    Similar titles

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    Document information
    Title:

    Intermetallic compound formation between lead-free solders (Sn) and Cu or Ni electrodes

    Contributors:

    Sasaki, T. (author) / Tanaka, M. (author) / Ohno, Y. (author)

    Published in:

    MATERIALS LETTERS ; 61 ; 2093-2095

    Publication date:

    2007-01-01

    Size:

    3 pages

    ISSN:

    0167-577X

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.1105 / 530

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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