A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
Si DRIE for Through-wafer Fabrication: An Option for Device-stacking Applications
Si DRIE for Through-wafer Fabrication: An Option for Device-stacking Applications
Si DRIE for Through-wafer Fabrication: An Option for Device-stacking Applications
Chambers, A. A. (author)
ADVANCED PACKAGING ; 15 ; 32-34
2006-01-01
3 pages
Article (Journal)
English
DDC:
658.564
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