A platform for research: civil engineering, architecture and urbanism
Isothermal Fatigue Damage Model for Lead-free Solder
Isothermal Fatigue Damage Model for Lead-free Solder
Isothermal Fatigue Damage Model for Lead-free Solder
Wei, Y. (author) / Chow, C. L. (author) / Vianco, P. (author) / Fang, E. (author)
2006-01-01
12 pages
Article (Journal)
English
DDC:
620.1
© Metadata Copyright the British Library Board and other contributors. All rights reserved.
Intergranular thermal fatigue damage evolution in SnAgCu lead-free solder
British Library Online Contents | 2008
|Comparison of isothermal mechanical fatigue properties of lead-free solder joints and bulk solders
British Library Online Contents | 2005
|Elasto-viscoplastic nonlocal damage modelling of thermal fatigue in anisotropic lead-free solder
British Library Online Contents | 2007
|An anisotropic mechanical fatigue damage evolution model for Pb-free solder materials
British Library Online Contents | 2009
|A cyclic viscoplastic and creep damage model for lead free solder alloys
British Library Online Contents | 2010
|