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Intergranular thermal fatigue damage evolution in SnAgCu lead-free solder

Erinc, M. / Schreurs, P. J. / Geers, M. G.

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Intergranular thermal fatigue damage evolution in SnAgCu lead-free solder

Erinc, M. / Schreurs, P. J. / Geers, M. G.

Intergranular thermal fatigue damage evolution in SnAgCu lead-free solder

Erinc, M. / Schreurs, P. J. / Geers, M. G.

Access

Access via TIB

Check availability in my library

Order at Subito €

Page navigation

Document information

Similar titles

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Document information

Title:

Intergranular thermal fatigue damage evolution in SnAgCu lead-free solder

Contributors:

Erinc, M. (author) / Schreurs, P. J. (author) / Geers, M. G. (author)

Published in:

MECHANICS OF MATERIALS ; 40 ; 780-791

Publication date:

2008-01-01

Size:

12 pages

ISSN:

0167-6636

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

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