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Microstructural evolution during transient liquid phase bonding of Inconel 617 using Ni-Si-B filler metal
Microstructural evolution during transient liquid phase bonding of Inconel 617 using Ni-Si-B filler metal
Microstructural evolution during transient liquid phase bonding of Inconel 617 using Ni-Si-B filler metal
Jalilian, F. (author) / Jahazi, M. (author) / Drew, R. A. (author)
MATERIALS SCIENCE AND ENGINEERING A ; 423 ; 269-281
2006-01-01
13 pages
Article (Journal)
English
DDC:
620.11
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