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    Phase-field Simulation of Transient Liquid Phase Bonding Process of Ni Using Ni-P Binary Filler Metal

    New search for: Natsume, Y.
    New search for: Ohsasa, K.
    New search for: Narita, T.

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    Phase-field Simulation of Transient Liquid Phase Bonding Process of Ni Using Ni-P Binary Filler Metal

    New search for: Natsume, Y.
    New search for: Ohsasa, K.
    New search for: Narita, T.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Phase-field Simulation of Transient Liquid Phase Bonding Process of Ni Using Ni-P Binary Filler Metal

    New search for: Natsume, Y.
    New search for: Ohsasa, K.
    New search for: Narita, T.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

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    Document information
    Title:

    Phase-field Simulation of Transient Liquid Phase Bonding Process of Ni Using Ni-P Binary Filler Metal

    Contributors:

    Natsume, Y. (author) / Ohsasa, K. (author) / Narita, T. (author)

    Published in:

    MATERIALS TRANSACTIONS ; 44 ; 819-823

    Publication date:

    2003-01-01

    Size:

    5 pages

    ISSN:

    1345-9678

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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