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Interfacial Microstructure and Joint Strength of Sn-Ag and Sn-Ag-Cu Lead Free Solders Reflowed on Cu/Ni-P/Au Metallization
Interfacial Microstructure and Joint Strength of Sn-Ag and Sn-Ag-Cu Lead Free Solders Reflowed on Cu/Ni-P/Au Metallization
Interfacial Microstructure and Joint Strength of Sn-Ag and Sn-Ag-Cu Lead Free Solders Reflowed on Cu/Ni-P/Au Metallization
Hirose, A. (author) / Hiramori, T. (author) / Ito, M. (author) / Tanii, Y. (author) / Kobayashi, K. F. (author) / Umakoshi, Y. / Fujimoto, S.
2006-01-01
6 pages
Article (Journal)
English
DDC:
620.11
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